1.Introduction                                             1. Computer Networks Unit-I Part 1           

 2.The Physical Layer                                    2. Computer Networks Unit-I Part 2

 3. The Datalink Layer                                   3  Computer Networks Unit-II Part 1

 4. Medium Access Control Sublayer               4. Computer Networks Unit-II Part 2

 5. The Network Layer                                   5. Computer Networks Unit-III Part 1

 6. The Transport Layer                                 6. Computer Networks Unit-III Part 2

 7. The Application Layer

 8. Network Security

Electronic Measurements and Instrumentation Unit - I

Electronic Measurements and Instrumentation Unit - II

Cathode Ray Oscilloscope

Electronic measurements and Instrumentation - 3

Electronic measurements and Instrumentation - 4           EMI Unit IV Bio-Medical Measurements 

CMS Unit III Monochrome TV                  CMS Unit IV Color TV

 1. Amplitude Modulation    2. Double Side Band Suppressed Carrier

 3. Single Side Band Suppressed Carrier   4. Frequency Modulation

 5. Radio Receivers   6. Radio Transmitters   7. Television Part 1  8. Television Part 2

 9  Color T V Part 1   10 Color T V Part 2   11 Telecommunications   12 Numbering Plan

                     Notes Analog Communications

Modulation and Need for Modulation         AM Time and Frequency Domains

Single Tone Modulation      Generation of AM      Detection of AM      Costas loop & QAM

Single Side Band    Vestigial Side Band

Introduction to Electrical and Electronic Circuits

1. Basics: KCL, KVL, Thevenin's theorem
2. RC and RL circuits (with DC sources)
3. RLC circuits (with DC sources)
4. Bode plots
5. Sinusoidal steady state and phasors
6. Resonance in RLC circuits
7. Diode circuits
8. BJTs: Part 1
9. BJTs: Part 2
10. BJTs: Part 3
11. Junction field-effect transistors
12. Op Amp circuits: Part 1
13. Op Amp circuits: Part 2
14. Op Amp circuits: Part 3
15. Op Amp circuits: Part 4
16. Op Amp circuits: Part 5
17. Op Amp circuits: Part 6
18. Digital circuits: Part 1
19. Digital circuits: Part 2
20. Digital circuits: Part 3
21. Digital circuits: Part 4
22. Digital circuits: Part 5

1. Introduction to the Course and Basic Concepts 
2. Signals & their Transportation
3. Elementary Signals in the Discrete Time Domain
4. Characterisation of Signals
5. Basic concepts of Linear Time Systems
6. Convolution Invertibility, & Stability Causality
7. Stability Unit, Step Response and Differential Equations
8. Systems Described by Differential & Difference Equations
9. Fourier & His Series
10. More About Fourier Series (With Uncomfortable Questions)
11. Those Uncomfortable Questions about the Existence of Fourier & Seriesand Some More
12. Introduction to Fourier Transform
13. Fourier Transform of Periodic Function & Fourier Transform Properties
14. More Properties of Fourier Transformation
15. Anatomy of a Class Test & a Continued Look at the Properties of Fourier Transform
16. Modulation, Convolutions and Other Interesting Properties of Fourier Transform
17. A Deeper Look at the Modulation Property of Fourier Transform.
18. Fourier Analysis of Discrete Time Signals & Systems - The Beginning
19. More About Fourier Transform of Discrete Time Signals
20. Further Look into the Properties of DTFT
21. Convolution, Modulation & Other Properties of DTFT
22. Farewell to Discrete Time Fourier Transform & Introduction to Sampling
23. More About Sampling
24. Introduction to Laplace Transform
25. Region of Convergence of Laplace Transform & Properties of LaplaceTransform
26. Properties of Laplace Transform (Contd.)
27. Concluding Discission on Laplace Transform
28. Introduction to Z Transform
29. Properties of Z Transform
30. Further Discussion on Properties of Z Transform
31. Solution to Class Test - 2, Concluding Discussion on Z Transform
32. Introduction to Random Signals & Probability
33. Probability Functions
34. Solutions to Minor Z Problems & more about PDF & pdf
35. More About PDF'S & pdf's
36. Classification of Random Processes & Introduction to CorrelationFunctions.
37. More About Correction Functions
38. Cross Correlation Function and their Properties
39. Introduction to Spectral Density
40. More About Spectral Density
41. Response of Linear System to Random Inputs
42. Frequency Domain Analysis of LTI Systems Excited by Random Inputs

1. Introduction to VLSI Technology

2. Design and Technology Overview of VLSI - I

3. Design and Technology Overview of VLSI - II

4. Yield and cost Estimation of VLSI Chips

5. Defects, Contamination & Clean Room Requirements

6. Wafer Cleaning Technology

7. Oxidation of Silicon

8. Reaction Kinetics of Oxide Growth in Silicon

9. Oxidation Techniques, Growth Rate & Characterization

10. Lithography Process

11. Photoresists

12. Optical Lithography Techniques

13. Exposure Tools and Optical Effects in Lithography

14. Advanced Lithography Techniques (X-ray,Ion-Beam,E-Beam)

15. Etching

16. Dry & Plasma Etching

17. Impurity Diffusion in Semiconductors

18. Diffusion Theory and Diffusion Systems

19. Impurities in Silicon and Diffusion Profile

20. Evaluation of Diffused Layers in Semiconductors

21. Ion Implantation : Range Theory and Stopping Mechanism

22. Ion Implantation Theory and Channeling

23. Ion Implant Machine

24. High Energy High Dose Implantation

25. Epitaxy Techniques and Classifications

26. Vapor Phase and Liquid Phase Epitaxy

27. VPE Growth Kinetics and MBE

28. Defects in Epitaxy Growth, Selective Epitaxy

29. Chemical Vapor Deposition (CVD): APCVD, LPCVD

30. CVD Techniques: PECVD, RTCVD, UHVCVD

31. Metal CVD and MOCVD

32. Materials for Contacts and Interconnects in VLSI

33. Metallization Techniques - I : Physical Evaporation

34. Metallization Techniques - II : Sputtering

35. Metallization Problems and Failure Mechanisms

36. Silicides and Copper Metallization

37. Isolation Technology in VLsI

38. Advanced Isolation Technology in VLSI

39. Bipolar VLSI Process Technology

40. MOS VLSI Process Technology

41. Advanced VLSI MOS/CMOS Process

42. CMOS/BiCMOS Process Technology

43. VLSI Assembly & Packaging : Chip and Wire Bonding